- AlSiC composites that have low SiC carbide content (<30 vol) are good for structural applications having higher strength than aluminum metal alone, but much higher strength and some ductility.
- AlSiC materials that have high SiC content (>50 vol%) have high thermal conductivity and lower thermal expansion than Aluminum metal - this is good for thermal expansion matching applications - "Thermal Management Applications".
Figure 1: AlSiC Microstructure SiC ceramic particulate in a continuous aluminum metal matrix phase. |
This weblog will concentrate on the Thermal Management applications of AlSiC which includes, microprocessor applications, power semiconductor heat sink applications, power module coolers for hybrid electric vehicles and also hermetic packaging applications. Each one of these items will be discussed in terms of application needs, material properties used in electronics systems, design capability, functionality and manufacturability.
This blog will also address Frequently Asked Questions AlSiC material questions and show by product examples.
More product literature and data sheets can be found www.alsic.com.