AlSiC Thermal Management Solutions

discussion on material properties and applications by Mark Occhionero PhD, VP of Marketing and Technical Sales of CPS Technologies. http://www.alsic.com

No posts with label Material Properties. Show all posts

No posts with label Material Properties. Show all posts

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Flip Chip Integrated Heat Sinks for Microprocessors (2)
IGBT Thermal Management Baseplates (2)
AlSiC Hermetic Packaging (1)
AlSiC Hybrid Electric Vehicle Power Modules (1)
AlSiC Metal Matrix Composite (1)
Thermal Management (1)
Thermal Management Material Properties (1)

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Mark Occhionero: Norton, MA, United States; VP of Marketing and Technical Sales of CPS Technologies. Joined CPS in 1985 and helped develop the AlSiC fabrication process as well as developing products for power semiconductor applications for IGBTs and power modules for hybrid electric vehicles.

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